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以有机硅树脂为基体,以金属Al、B4C和气相法制备的SiO2为无机填料制备了耐高温胶黏剂。采用X射线衍射仪、扫描电子显微镜、能谱分析仪和热重分析分别研究了胶黏剂的相组成、微观结构及热稳定性,通过抗压剪切强度测试陶瓷黏结性能。结果表明:胶黏剂经1 150℃热处理后的质量增加了38%;当用于刚玉陶瓷黏接时,黏接试样200℃固化后的黏接强度为9.00MPa,经1 000℃热处理后提高到45.60MPa。黏接机理分析表明,当温度小于600℃,黏接强度来源于胶黏剂中的有机硅树脂;超过600℃,金属Al粉和B4C氧化并与有机树脂裂解产物发生反应,生成xSiOm Cn·yB2O3、2Al2O3·B2O3和9Al2O3·2B2O3等玻璃/陶瓷相,氧化伴随着体积膨胀可有效抑制有机基体高温裂解导致的体积收缩,并愈合裂解带来的微观缺陷。此外黏接界面发生元素互扩散层,引入化学键的作用,进一步提高了胶黏剂的高温黏接强度。
Abstract：A high-temperature adhesive was prepared with silicone resin as a matrix,metal Al,B4 C and fumed SiO2 powders as inorganic fillers.The phase compositions,microstructures and thermal stability of the adhesive were analyzed by X-ray diffraction,scanning electron microscopy,energy dispersive spectrometry and thermogravimetry,respectively.The bonding performance of the adhesive for ceramic joints was characterized through the compressive shear strength test.The results indicate that the mass of the adhesive increases 38%after heat treatment at 1 150℃.The bonding strength of ceramic joints is 9.00MPa after cured at 200℃,and increases to be 45.60MPa at 1 000℃.According to the mechanism analysis,the bonding strength is derived from organic silicone resin in the adhesive at<600℃,and metal Al and B4 C powders should be oxidized and then reacted with pyrolysis products of silicone resin to produce the ceramic/glass phases like xSiOm Cn ·yB2 O3,2Al2 O3 ·B2 O3 and 9Al2 O3 ·2B2 O3 at>600℃.The volume expansion caused by the oxidation of inorganic fillers can effectively inhibit the volume shrinkage by the pyrolysis of organic silicone resin at elevated temperatures and heal the micro-defects.In addition,chemical bonds are introduced into the bonding interfaces through the formation of element mutual diffusion layer,further improving the bonding strength at elevated temperatures.
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基本信息:
中图分类号:TQ433.4
引用信息:
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2013-12-27
2013-12-27
2013-12-27